Products & Services

Wafer Sort Test Services (CP)

We provide engineering and volume wafer sort (CP1/CP2) test services, covering CP test program development and probe card design and manufacturing, delivering a closed loop from engineering validation to production ramp-up and yield improvement.

• CP test program development: functional, DC/AC parameters, trimming, eFlash, IP and DFT tests
• Engineering-validation and production-grade probe cards, quickly matching test needs
• 8/12-inch wafers, Class 1000 cleanroom, 24-hour continuous volume operation
• Analysis of wafer maps and yield data, with failure analysis feedback loop, to sustain continuous yield improvement.

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Final Test Services (FT)

We provide FT (final test) test program development and supporting test hardware solutions, covering the entire flow from engineering validation to volume production, helping chips reach the market efficiently and reliably.

• Test requirement analysis, solution definition and ATE platform selection
• FT test program development and debug, supporting tri-temperature testing
• Test hardware design: Loadboard / Change Kit / Socket
• Engineering-lot validation, production deployment, yield monitoring and yield optimization

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Probe Card & Loadboard Design

Probe cards and loadboards are the core interface hardware connecting ATE to devices in CP and FT test. We provide design and manufacturing of the full range of probe cards — cantilever, vertical and MEMS — as well as FT production loadboards, covering test needs for digital, analog, RF and memory devices.

• Cantilever probe cards: cost-effective, ideal for wide-pitch analog and power devices
• Vertical probe cards: high-density arrays for high-pin-count, fine-pitch volume test
• MEMS probe cards: ultra-fine, highly consistent needles for advanced-node chips
• Loadboard design & manufacturing: high-density, high-speed, high-current design for AI, NPU, GPU, CPU, SoC, FPGA, memory, MCU and analog chips

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Tooling Design & Manufacturing

For ATE volume production and engineering validation, we design and manufacture test sockets, change kits, burn-in sockets and other test tooling, ensuring stable electrical contact and efficient device handling in automated test.

• Custom sockets for BGA / QFN / LGA / WLCSP and more
• Change kit design and manufacturing — precise DUT pick-and-place on mainstream handler platforms.
• Burn-in sockets from -55℃ to 175℃, high current and long insertion life
• Controlled-impedance design for high-frequency use, minimizing loss and crosstalk

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ATE Mass Production Test Services

Our test services fully cover mainstream tester platforms at home and abroad, flexibly matching the optimal test solution for each chip type and test requirement.

• Advantest: V93k / 5833 / 5830 / 5503HS2
• Teradyne: UltraFlex Plus / UltraFlex / J750 / ETS88
• Accotest: 8300 / 8200
• Chroma 3380P, ytec S100/S200 and more

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Reliability Test Services

Offering burn-in and reliability test programs such as HTOL, LTOL and ELFR, backed by our in-house burn-in board design capability — delivering complete data support for product reliability screening and lifetime evaluation.

• Wide-temperature capability from -55℃ to 175℃
• Multi-slot burn-in ovens running in parallel for high-volume screening
• Burn-in board hardware design: schematic, layout, IR-drop and thermal simulation
• Fully automated data acquisition and traceability

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Foundry Services

Working with leading foundries at home and abroad, we offer one-stop services for MPW shuttle and full-mask tape-out, significantly reducing prototyping cost and cycle time.

• MPW multi-project shuttle runs that dramatically share mask and wafer costs
• Full process coverage from 180nm to 5nm, across mature and advanced nodes and platforms including Logic, Mixed-Signal, RF, and BCD.
• DRC / LVS / DFM checks and layout merge before GDSII submission
• Mask making, wafer-fab tracking, dicing and sample delivery

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Package Design Service

Partnering with top OSAT companies at home and abroad, we provide one-stop services covering package selection, substrate and leadframe design, packaging production and reliability verification, across conventional and advanced packages.

• Leadframe packages: SOP / SSOP / QFP / QFN / DFN, etc.
• Substrate packages: BGA / LGA / FCCSP / FCBGA / SiP
• Wafer-level packaging: Bumping / WLCSP / Fan-out / TSV
• Fast engineering-lot sampling with low minimum order, enabling a seamless ramp to volume production.

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