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Follow the latest progress of Platinum Test Semiconductor
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Company milestones, industry insights and event highlights
Platinum Test's self-developed new-generation MEMS probe card has passed customer validation and entered volume production, with key specifications reaching internationally advanced levels.
The service provides board-level functional and system-level validation for packaged devices and modules, completing the full CP–FT–SLT test chain.
Chiplet integration raises requirements on known-good-die and interposer testing. More validation must be completed before packaging, deepening the coordination between test, design and packaging.
Coordinated optimisation of the thermal control module and handler cycle time has noticeably improved changeover efficiency and strengthened parallel scheduling across hot and cold lots.
The two parties will cooperate deeply in automotive-grade chip testing and establish a joint test and validation laboratory.
Through scheduling optimisation, program reuse and parallel station allocation, turnaround for regular production lots has been further reduced, with greater flexibility for urgent orders.
As the installed base of domestic test platforms grows, so does the need to run the same device across multiple platforms, making modular and portable program design a development standard.
The -40°C to 150°C full-range final test flow has matured and can now handle volume orders in line with AEC-Q100 requirements.
Our self-developed burn-in sockets and load boards have passed multiple reliability validation rounds, supporting various package types and shortening prototyping cycles.
As new energy vehicles and intelligent driving gain penetration, demand for full-range -40°C to 150°C testing under AEC-Q100 continues to grow, making tri-temperature capability a key criterion for OEMs and Tier 1 suppliers.
For customers in engineering validation and pilot runs, the channel offers priority scheduling, fast feedback and dedicated stations, shortening the wait from samples to data.
The survey covered turnaround time, test yield, responsiveness and technical service. Customer feedback feeds directly into the annual improvement plan.
Packaging houses, chip designers and test peers joined the discussion on how package design affects test accessibility.
Large models and intelligent driving are pushing shipments of high-compute chips, raising requirements on vector depth and parallel test sites. Coordinated development and capacity allocation across V93K, UltraFlex and STS8300 platforms are becoming central to delivery capability.
Unified scheduling links idle capacity across platforms, improving both tester utilisation and delivery stability during peak periods.
Memory and compute-in-memory products are driving parallel test demand. Higher site counts and vector depth place greater demands on load board and power integrity design.
The platform unifies program frameworks across V93K, UltraFlex and STS8300 systems, enabling cross-platform reuse and version control.
Image recognition automatically reads probe mark size and position, reducing manual judgement variation and providing data for probe card maintenance intervals.
Practical training on ATE test principles, program development and production data analysis, delivered online or on site.
We exchanged views on test technology trends across the supply chain and shared our practice in multi-platform coordinated testing.
More design houses are outsourcing their entire test flow. Providers with full-chain capability from test development to volume operations are better positioned to win long-term orders.
The meeting set tri-temperature production, advanced packaging coordination and test program platformisation as the year's priorities.
The evaluation board has been iterated on material selection, impedance control and link simulation to support engineering validation of high-speed interfaces.
With additional burn-in sockets and load boards, reliability programmes such as burn-in now support a wider range of package types.
The cooperation covers tri-temperature final test and reliability validation, backed by a dedicated line and project management team.
System-in-package requirements raise the bar for known-good die, increasing the importance of wafer-level test and wafer-level burn-in.
Adaptation and validation of wafer-level burn-in on the test platform are complete, providing an upstream screening option for high-reliability products.
A dedicated team supports long-term production customers with yield variation analysis, test condition optimisation and failure re-test.
Customers toured the test floor and saw a live walkthrough from program debug to production lot runs.
Domestic supply capability for probe cards, load boards and test sockets continues to strengthen, improving both lead time and cost structure.
Standardised cleaning, probe replacement and tip alignment procedures, combined with spare inventory, reduce maintenance waiting time.
New energy and industrial control are driving power device shipments, placing new demands on tester high-voltage/high-current resources and safety protection design.
The platform performs real-time statistics and trend monitoring on production test data, noticeably shortening the time to locate abnormal lots.
The new team focuses on test program development and hardware design, forming a collaborative setup with Shanghai and Suzhou.
The session introduced ATE test principles and industry practice to microelectronics students, supporting the industry talent pipeline.
Systematic optimisation across test time, parallel site count and consumable life has become the main lever for controlling per-die test cost.
Load board and program optimisation raise site counts, improving throughput per unit time without adding testers.
For engineering validation and sample-stage customers, the channel offers shorter packaging scheduling cycles and faster iteration.
We exchanged experience on the AEC-Q100 qualification flow and tri-temperature reliability validation with OEMs, Tier 1 suppliers and peers.
With OEMs pressing for faster device adoption, providers with complete tri-temperature and reliability validation capability can significantly cut qualification preparation time.
Common change kit structures and interfaces are now standardised, shortening tooling design cycles and reducing duplicated development cost.
The meeting reviewed the year's results and recognised teams and individuals outstanding in test development and customer service.
Our technical experts joined relevant test standard discussions, feeding frontline production experience back into the standard-setting process.
A review of how test demand structure changed over the year, with an outlook on tri-temperature testing and test for advanced packaging.
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