PLATINUM TEST · PRECISION · RELIABILITY · INNOVATION

Every Chip, Proven Reliable
One-Stop CP & FT Test Development and Production Solutions

Deeply engaged in ATE test development and mass-production, spanning the full chain of wafer tape-out, test development and production, and package services — covering complete steps from packaging and test solution design, program and hardware development, to volume testing and yield improvement. Our professional technical capability escorts chip products to market faster and more reliably.

0Years of Experience
0Happy Clients
0Granted Patents
0Test Yield

BUSINESS OVERVIEW

Our Business

As a test partner to fabless companies, we deliver turnkey solutions spanning test development through volume production.

One-stop service capability ring

Core Capabilities

ATE Program Development V93K, UltraFlex Plus, J750, Accotest, Chroma, ytec S100 and more
Test Hardware Solutions CP probe cards, load boards, stiffeners, change kits, sockets
Foundry Tape-out MPW shuttle and full mask, 180nm to 5nm
Packaging Services Package selection through volume production

Cooperation Models

  • As a high-end test development solution provider, we flexibly support both Turnkey and NRE + mass production models, helping customers deliver faster with better yield and product competitiveness.

CORE BUSINESS

Core Business

Three core capabilities — program development & mass-production operation, test hardware design and reliability validation — covering the full chip test flow

ATE tester lineup
Test software UI
Shmoo map analysis
UltraFLEX load board
Wafer probe card
Burn-in board socket array
High-speed PCB
Test tooling change kit
IC test socket
CP · FT · SLT · Burn-in · EVB · MLO · Substrate Design
01

Program Development & Mass Production Operation

Covering AI, Edge AI (NPU), GPU, CPU, SoC, FPGA, DDR3/4, MCU, Flash, memory, analog, RF and mixed-signal devices to ensure efficient NPI ramp-up.

AIEdge AIGPUCPUSoCFPGADDR3/4MCUFlashMemoryAnalogRFMixed-signal
02

Test Hardware Design

One-stop design and manufacturing of test hardware — CP probe cards, load boards, SLT test boards, EVB boards, test sockets and fixture tooling — complemented by high-speed PCB layout, SI/PI and thermal simulation to ensure signal integrity and production reliability.

Probe CardLoad BoardSLTEVBSocketToolingSI/PI Simulation
03

Reliability Test Services

Burn-in board design and manufacturing, supported by reliability test programs including HTOL, LTOL and ELFR, with complete data support for screening and lifetime evaluation.

Burn-in BoardHTOL / LTOL / ELFR
04

Package Design

Chip–package–board co-design: package selection, stack-up architecture and 10–40 layer high-density MLO routing, backed by SI/PI and thermal–mechanical–electrical simulation — balancing performance, cost and manufacturability to shorten production ramp-up.

Package Design ServiceSubstrate DesignMLOFCBGASiPCo-Simulation

TESTING PROCESS

Delivery Process

Standardized workflow with quality control at every step

1

Requirement Review

Analyze chip specs
define test items

→
2

Solution Design

Custom test hardware
and program development

→
3

Validation & Debug

Engineering-lot testing
parameter optimization

→
4

Production Ramp

Capacity ramp-up
continuous yield monitoring

→
5

Ongoing Support

Data analysis feedback
continuous technology upgrades

ATE DEVELOPMENT PROCESS

Project Management

Five interlocked phases with checkpoints to keep every deliverable under control

Checkpoint 1

Deliverables:

  • Project requirements / test plan
  • PC/LB design specs / fixture requirements
Checkpoint 2

Deliverables:

  • Development plan / project status updates
Checkpoint 3

Deliverables:

  • Hardware design review, DIB diagnosis
Checkpoint 4

Deliverables:

  • T10 program (DC + DFT modes) with datalogs
  • A10 program (all test items & TTR) with datalogs
  • B10 program and datalog check
Checkpoint 5

Deliverables:

  • Project summary (lessons learned)
  • LVM report
Requirement Analysis
Project Planning
Design & Development
Debug & Verification
Production & Ramp-up
  • Requirement
  • Project plan
  • SOW (Statement of Work)
  • Offline code
  • Probe card design
  • DIB / load board design
  • SI/PI simulation
  • Mechanical design, fabrication & probe assembly
  • Debug
  • T10 version release
  • Correlation & characterization
  • A10 version release
  • B10 version release
  • Project closure
  • Production maintenance

SUPPLIERS & CUSTOMERS

Partners

Long-term business relationships across the semiconductor test supply chain

Advantest
JCET
AccoTEST
Chroma ATE
Huatian Technology
YTEC
ATX Group

* All trademarks are the property of their respective owners and are used solely to indicate business relationships.

CONTACT US

Contact Us

We look forward to discussing your testing needs

Online Message

Tell us what you need — we will get back to you within one business day

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Need a faster reply? Email us at business@ptest.cn or call +86 13279209275

From Test Development to Volume Production — One-Stop Turnkey Solutions

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